DSW801K
802.11bgn+BT4.2 ,MT7697 ,SMT ,1T1R
WiFi
►Chipset:MT7697
►WiFi-Band:2.4GHz
►Interface:SMT
►Data Rate:PHY rate up to 150Mbps
►Security:WEP, WPA, WPA2
►Dimension:18mm x 18mm 
 
Bluetooth
►BT-Band:2.4 GHz
►Standard:Bluetooth 2.1+EDR/3.0 and BT4.2 Dual Mode
►Support for Bluetooth Low Energy
DSW801K is a low-cost and low-power consumption IoT module. This stand-alone module is an operating system designed for wearable or internet of things (IoT) devices with smart connection and cloud application/services.
DSW801K is a highly integrated SIP module which features an application processor, a low power
1x1 11n singlw-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. DSW801K also includes embedded SRAM/ROM and an external 4MB serial flash.
The Wi-Fi subsystem contains the 802.11b/g/n radio, baseband, and MAC that are designed to meet both the low power and high throughput application. It also contains a 32-bit RISC CPU that could fully offload the application processor.
The Bluetooth subsystem contains the Bluetooth radio, baseband, link controller. It also uses the same 32-bit RISC CPU for the Bluetooth protocols.
| 
			 General  | 
		||||||
| 
			 Chipset  | 
			
			 MT7697  | 
		|||||
| 
			 Core  | 
			
			 ARM Cortex-M4 MCU  | 
		|||||
| 
			 FPU Clock Speed  | 
			
			 192MHz  | 
		|||||
| 
			 SRAM  | 
			
			 352KB  | 
		|||||
| 
			 External Flash  | 
			
			 4MB  | 
		|||||
| 
			 Antenna connector  | 
			
			 MHF4 series: 20449-001E  | 
		|||||
| 
			 Operation Condition  | 
		||||||
| 
			 Temperature  | 
			
			 Operating : -40℃ ~ +85℃  | 
		|||||
| 
			 Storage : -40℃ ~ +105℃  | 
		||||||
| 
			 Humidity  | 
			
			 Operating : 10 ~ 95% (Non-Condensing)  | 
		|||||
| 
			 Storage : 5 ~ 95% (Non-Condensing)  | 
		||||||
| 
			 Mechanical Information  | 
		||||||
| 
			 Dimension  | 
			
			 18mm X 18mm X 1.7mm (Typ.)  | 
		|||||
| 
			 Package  | 
			
			 LGA 44Pin – Stamp hole type  | 
		|||||
| 
			 Certification  | 
		||||||
| 
			 CE FCC  | 
		||||||
| 
			 Electrical Characteristics  | 
		||||||
| 
			 Symbol  | 
			
			 Parameter  | 
			
			 Min.  | 
			
			 Typ.  | 
			
			 Max.  | 
			
			 Unit  | 
		|
| 
			 VBAT  | 
			
			 Supply Voltage  | 
			
			 3  | 
			
			 3.3  | 
			
			 3.6  | 
			
			 V  | 
		|
| 
			 I/O Voltage  | 
			
			 I/O supply voltage  | 
			
			 3  | 
			
			 3.3  | 
			
			 3.6  | 
			
			 V  | 
		|
| 
			 Country  | 
			
			 Certification  | 
		
| 
			 EU  | 
			
			 CE  | 
		
| 
			 USA  | 
			
			 FCC  | 
		


