DSW801K
802.11bgn+BT4.2 ,MT7697 ,SMT ,1T1R
WiFi
►Chipset:MT7697
►WiFi-Band:2.4GHz
►Interface:SMT
►Data Rate:PHY rate up to 150Mbps
►Security:WEP, WPA, WPA2
►Dimension:18mm x 18mm
Bluetooth
►BT-Band:2.4 GHz
►Standard:Bluetooth 2.1+EDR/3.0 and BT4.2 Dual Mode
►Support for Bluetooth Low Energy
DSW801K is a low-cost and low-power consumption IoT module. This stand-alone module is an operating system designed for wearable or internet of things (IoT) devices with smart connection and cloud application/services.
DSW801K is a highly integrated SIP module which features an application processor, a low power
1x1 11n singlw-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. DSW801K also includes embedded SRAM/ROM and an external 4MB serial flash.
The Wi-Fi subsystem contains the 802.11b/g/n radio, baseband, and MAC that are designed to meet both the low power and high throughput application. It also contains a 32-bit RISC CPU that could fully offload the application processor.
The Bluetooth subsystem contains the Bluetooth radio, baseband, link controller. It also uses the same 32-bit RISC CPU for the Bluetooth protocols.
General |
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Chipset |
MT7697 |
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Core |
ARM Cortex-M4 MCU |
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FPU Clock Speed |
192MHz |
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SRAM |
352KB |
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External Flash |
4MB |
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Antenna connector |
MHF4 series: 20449-001E |
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Operation Condition |
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Temperature |
Operating : -40℃ ~ +85℃ |
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Storage : -40℃ ~ +105℃ |
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Humidity |
Operating : 10 ~ 95% (Non-Condensing) |
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Storage : 5 ~ 95% (Non-Condensing) |
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Mechanical Information |
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Dimension |
18mm X 18mm X 1.7mm (Typ.) |
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Package |
LGA 44Pin – Stamp hole type |
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Certification |
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CE FCC |
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Electrical Characteristics |
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Symbol |
Parameter |
Min. |
Typ. |
Max. |
Unit |
|
VBAT |
Supply Voltage |
3 |
3.3 |
3.6 |
V |
|
I/O Voltage |
I/O supply voltage |
3 |
3.3 |
3.6 |
V |
Country |
Certification |
EU |
CE |
USA |
FCC |