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DSW801K
  • DSW801K

DSW801K

802.11bgn+BT4.2 ,MT7697 ,SMT ,1T1R

    WiFi
    ►Chipset:MT7697
    ►WiFi-Band:2.4GHz
    ►Interface:SMT
    ►Data Rate:PHY rate up to 150Mbps
    ►Security:WEP, WPA, WPA2
    ►Dimension:18mm x 18mm 

     

    Bluetooth
    ►BT-Band:2.4 GHz
    ►Standard:Bluetooth 2.1+EDR/3.0 and BT4.2 Dual Mode
    ►Support for Bluetooth Low Energy

DSW801K is a low-cost and low-power consumption IoT module. This stand-alone module is an operating system designed for wearable or internet of things (IoT) devices with smart connection and cloud application/services.

DSW801K is a highly integrated SIP module which features an application processor, a low power
1x1 11n singlw-band Wi-Fi subsystem, a Bluetooth subsystem, and a Power Management Unit. The application processor subsystem contains an ARM Cortex-M4F MCU, which has many peripherals, including UART, I2C, SPI, I2S, PWM, IrDA, and auxiliary ADC. DSW801K also includes embedded SRAM/ROM and an external 4MB serial flash.

The Wi-Fi subsystem contains the 802.11b/g/n radio, baseband, and MAC that are designed to meet both the low power and high throughput application. It also contains a 32-bit RISC CPU that could fully offload the application processor.

The Bluetooth subsystem contains the Bluetooth radio, baseband, link controller. It also uses the same 32-bit RISC CPU for the Bluetooth protocols.

General

Chipset

MT7697

Core

ARM Cortex-M4 MCU

FPU Clock Speed

192MHz

SRAM

352KB

External Flash

4MB

Antenna connector

MHF4 series: 20449-001E

Operation Condition

Temperature

Operating : -40℃ ~ +85℃

Storage : -40℃ ~ +105℃

Humidity

Operating : 10 ~ 95% (Non-Condensing)

Storage : 5 ~ 95% (Non-Condensing)

Mechanical Information

Dimension

18mm X 18mm X 1.7mm (Typ.)

Package

LGA 44Pin – Stamp hole type

Certification

CE FCC

Electrical Characteristics

Symbol

Parameter

Min.

Typ.

Max.

Unit

VBAT

Supply Voltage

3

3.3

3.6

V

I/O Voltage

I/O supply voltage

3

3.3

3.6

V

Country

Certification

EU

CE

USA

FCC

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