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MPE702Q
  • MPE702Q

MPE702Q

3.75G HSUPA+ miniPCI Express Card

    Improved power-saving modes
    NDIS/USB driver for Microsoft®
    Windows® 2000, Windows® XP, Windows®
    Vista32/64,Windows® 7
    RIL/NDIS/USB driver for devices based on
    Microsoft® Windows Mobile™5.0 and its
    Successor
    USB driver for Linux2.4.x, Linux2.6.x
    Customer IMEI as variant
    Firmware update via USB
    Windows application PC_SUITE Auto-installation
    Simple, easy deployment
    RoHS compliant 

     

Bointec MPE702Q HSPA+ Full size PCI Express Mini card is an embedded module, it can be easily integrated into laptops or other devices for 3G mobile data application offering data, SMS solutions. MPE702Q offers high performance to the user and operates globally on 900/2100MHz bands on HSPA+ and UMTS networks. In areas where HSPA+ service are not available, Bointec MPE702Q still enables reliable and secure data connections over HSPA/UMTS or EDGE/GPRS network.

MPE702Q Specification

Band

GMS(Quad-Band)

850/900/1800/1900 MHz

HSPA+/UMTS

900/2100MHz

Transmission
Speed

Uplink

up to 5.76 Mbps

Downlink

up to 21 Mbps

Data Devices

EDGE (E-GPRS)
(multi-slot class 12)

• EDGE class 12: Max. 237 kbps (DL),
                           Max. 118 kbps (UL)
• Mobile station class B
• Modulation and coding scheme MCS 1-9

GPRS
(multi-slot class 12)

• GPRS class 12: Max. 85.6 kbps (DL)
                           Max. 42.8 kbps (UL)
• Mobile station class B
• Full PBCCH support
• Coding schemes CS 1-4

UMTS/HSUPA
(3GPP release 6)

• HSPA+: Max. 21 Mbps (DL)
               Max. 5.76 Mbps (UL)
• HSDPA Category 6/8/14 supported
• HSUPA Category 3/4/6 supported
• Compressed mode according to 3GPP TS25.212
• UMTS: Max. 384 kbps (DL)
              Max. 384 kbps (UL)

GSM

3GPP release 99

SMS (Short Massage)

• Point-to-point MO and MT
• SMS cell broadcast
• Text and PDU mode

CSD data transmission

• GSM data rate 14.4 kbps, V.110
• UMTS data tate 57.6 kbps, V.120
• RLP (Non-transparent mode)

Radio Power

Tx Output Control
Standard

- Class 4 (2 W) for GSM900
- Class 3 (0.25 W) for UMTS/HSUPA
- Class E2 (0.5 W) for EDGE900
- Class E2 (0.4 W) for EDGE1800
- Class 1 (1 W) for GSM1800

Control

AT commands
(Hayes 3GPP TS 27.007 and 27.005)

SIM Slot

SIM Application Toolkit (release 99)

Power consumption

Votage

3.0V~3.6V

Watts/Current

10W Maximum

Average Supply Current

< 800mA(HSPA data transfer)

Sleep mode

<4mA

Power down

50 μA

Form Factor

Dimension

51*30*4.5 mm

Weight

12 g

Tempreature

Normal Operation

-20°C to +65°C

Extremely Operation

-30°C to +75°C

Storage

-40°C to +85°C

Interface

PCI express mini Card

• Hirose U.FL-R-SMT 50   antenna connector
• PCI Express® Mini Card Interface (Revision 1.2)
• USB 2.0 high speed
• UICC/SIM card interface 3 V, 1.8 V
• Flying Mode
•Network status
•UART
• GPIOs

Driver

Windows

XP / XP Embedded / CE / Vista / Win7 / Win8

Linux

Kernel 2.4.24 (later)

Mac

Mac Operation System

Certification

GCF

Y(on plan)

PTCRB

Y(on plan)

CE

Y

FCC

Y

NCC

n/a

RoHS Compliance

Y

WHQL

n/a

A-Tick

n/a

MPE702Q Certifications  
Europe CE (0700) class1
USA FCC
China CTA
USA (by contact Bointec Sales)
Japan (Pending)
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